PLASMA SOURCES
SURFACE WAVE PROCESSING :: Reduced Cycle Times
A surface wave plasma tool that reduces chamber cycle times with fast, damage free processing integrated on existing equipment.

Benefits
  • Works with reactive gas chemistries
  • Damage-free processing for nearly all materials
  • Save at least ½ second per PEALD half-cycle
  • Fast pulsed (<1msec) or steady state operation
  • No matching network required
  • Compact size

Applications
  • Plasma Enhanced Atomic Layer Deposition (PEALD)
  • Plasma Enhanced Chemical Vapor Deposition (PECVD)
  • Surface treatments
  • Etching, Ashing, Cleaning
ATMOSPHERIC PRESSURE :: Plasma Surface Treatments
A hand-held atmospheric-pressure source for surface treatment and functionalization, including adhesion and bonding promotion, hydrophilic/phobic control and texturization.

Features
  • Many plasma and gas mixture options
  • Source head diameter ranges from sub-mm to cm-scale
  • Atmospheric-pressure processing reduces costs
  • Innovative dielectric barrier jet source
  • Drive electronics built into handle for added safety
  • Variety of applications, including: medicine, electronics, printing
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